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Data Sheet

Rev. 1.00 / December 2011

ZSSC3016

Low Power, High Resolution 16-Bit Sensor Signal Conditioner

ZSSC3016

Low Power 16 Bit Sensor Signal Conditioner IC

Brief Description

The ZSSC3016 is a sensor signal conditioner

(SSC) integrated circuit for high-accuracy ampli-

fication and analog-to-digital conversion of a differ-

ential input signal. Designed for high resolution

altimeter module applications, the ZSSC3016 can

perform offset, span, and 1 and 2

order

temperature compensation of the measured signal.

Developed for correction of resistive bridge

sensors, it can also provide a corrected

temperature output measured with an internal

sensor.

The measured and corrected bridge values are

provided at the digital output pins, which can be

configured as I C* (≤ 3.4MHz) or SPI (≤ 20MHz).

Digital compensation of signal offset, sensitivity,

temperature, and non-linearity is accomplished via

an 18-bit internal digital signal processor (DSP)

running a correction algorithm. Calibration coeffici-

ents are stored on-chip in a highly reliable, non-

volatile, multiple-time programmable (MTP) mem-

ory. Programming the ZSSC3016 is simple via the

serial interface and the PC-controlled calibration

software provided in the ZMDI Development Kit.

The interface is used for the PC-controlled cali-

bration procedure, which programs the set of cali-

bration coefficients in memory. The digital mating

is fast and precise, eliminating the overhead

normally associated with trimming external com-

ponents and multi-pass calibration routines.

Benefits

•

Integrated 18-bit calibration math DSP

Fully corrected signal at digital output

Minimize calibration costs through the one-pass

calibration concept

No external trimming components required

Highly integrated CMOS design

Excellent for low-voltage and low-power battery

applications

Physical Characteristics

•

Supply voltage range: 1.8 to 3.6V

Current consumption: 1mA (operating mode)

Sleep State current <250nA (25°C)

Temperature resolution: <0.003K/LSB

Operation temperature: –40°C to +85 °C

Small die size: 1.5mm²

Delivery options: die for wafer bonding

Typical Applications

The ZSSC3016 is designed for operation in

calibrated resistive (pressure) sensor modules:

•

Features

•

Flexible, programmable analog front-end

design; up to 16-bit scalable, charge-balancing

two-segment analog-to-digital converter (ADC)

Fully programmable gain amplifier accepting

sensors from 14 to 72 (linear factor)

Internal auto-compensated temperature sensor

Digital compensation of individual sensor offset;

1 and 2 order digital compensation of sensor

gain

Digital compensation of 1 and 2 order tem-

perature gain and offset drift

Intelligent power management unit

Layout customized for die-die bonding with

sensor for high-density chip-on-board assembly

Typical sensor elements can achieve accuracy

of less than ±0.10% FSO @ -40 to 85 °C

C is a registered trademark of NXP.

Barometric altitude measurement for portable

navigation

Altitude measurement for emergency call

systems

Altitude measurement for car navigation

Inside hard disk pressure measurement

Weather forecast

Fan control

ZSSC3016 Application Example.

The information furnished in this publication is

PRELIMINARY

and subject to changes without notice.

ZSSC3016

Low Power 16 Bit Sensor Signal Conditioner IC

ZSSC3016 Block Diagram

Ordering Information

Ordering Examples *

ZSSC3016CC1B

ZSSC3016CI1B

ZSSC3016CI1D ES

ZSSC3016KIT

Description

Temperature range: –40°C to +85 °C,

Consumer-Level: Parameter according Data Sheet

Temperature range: –40°C to +85 °C,

Industrial-Level: 10 years MTP-Data Retention; 20FIT

Engineering Samples, Temperature range: –40°C to +85 °C

ZSSC3016 Evaluation Kit, including sample, modular evaluation

board, and evaluation software.

Package

Wafer (304um) unsawn

Dice in Waffle Pack

Kit

* Please contact ZMDI Sales for additional options.

Sales and Further Information

Zentrum Mikroelektronik

Dresden AG

Grenzstrasse 28

01109 Dresden

Germany

Phone

Fax

+49 (0)351.8822.7.772

+49 (0)351.8822.87.772

www.zmdi.com

Zentrum Mikroelektronik

Dresden AG, Japan Office

2nd Floor, Shinbashi Tokyu Bldg.

4-21-3, Shinbashi, Minato-ku

Tokyo, 105-0004

Japan

Phone

Fax

+81.3.6895.7410

+81.3.6895.7301

sales@zmdi.com

ZMD FAR EAST, Ltd.

3F, No. 51, Sec. 2,

Keelung Road

11052 Taipei

Taiwan

Phone

Fax

+886.2.2377.8189

+886.2.2377.8199

ZMD America, Inc.

8413 Excelsior Drive

Suite 200

Madison, WI 53717

USA

Phone

Fax

+1 (608) 829-1987

+1 (631) 549-2882

DISCLAIMER: This information applies to a product under development. Its characteristics and specifications are

PRELIMINARY

and subject to change without notice. Zentrum

Mikroelektronik Dresden AG (ZMD AG) assumes no obligation regarding future manufacture unless otherwise agreed to in writing. The information furnished hereby is believed to be true

and accurate. However, under no circumstances shall ZMD AG be liable to any customer, licensee, or any other third party for any special, indirect, incidental, or consequential damages of

any kind or nature whatsoever arising out of or in any way related to the furnishing, performance, or use of this technical data. ZMD AG hereby expressly disclaims any liability of ZMD AG

to any customer, licensee or any other third party, and any such customer, licensee and any other third party hereby waives any liability of ZMD AG for any damages in connection with or

arising out of the furnishing, performance or use of this technical data, whether based on contract, warranty, tort (including negligence), strict liability, or otherwise

ZSSC3016

Low Power 16 Bit Sensor Signal Conditioner IC

Table of Contents

IC Characteristics .......................................................................................................................................... 7

1.1.

1.2.

1.3.

1.4.

2.1.

2.2.

2.3.

Absolute Maximum Ratings.................................................................................................................... 7

Operating Conditions.............................................................................................................................. 7

Electrical Parameters ............................................................................................................................. 8

Power Supply Rejection Ratio vs. Frequency ...................................................................................... 10

Brief Description ................................................................................................................................... 11

Signal Flow and Block Diagram ........................................................................................................... 11

Analog Front End ................................................................................................................................. 12

Amplifier ......................................................................................................................................... 12

Analog-to-Digital Converter ........................................................................................................... 14

Temperature Measurement ........................................................................................................... 17

Bridge Supply................................................................................................................................. 17

Digital Signal Processor (DSP) Core ............................................................................................. 17

MTP Memory ................................................................................................................................. 17

Clock Generator............................................................................................................................. 17

Power Supervision ......................................................................................................................... 18

Interface ......................................................................................................................................... 18

Circuit Description ....................................................................................................................................... 11

2.3.1.

2.3.2.

2.3.3.

2.3.4.

2.4.

2.4.1.

2.4.2.

2.4.3.

2.4.4.

2.4.5.

3.1.

3.2.

3.3.

3.4.

3.5.

Digital Section....................................................................................................................................... 17

Functional Description................................................................................................................................. 19

Power Up.............................................................................................................................................. 19

Measurements...................................................................................................................................... 19

Operational Modes ............................................................................................................................... 19

Command Interpretation....................................................................................................................... 21

SPI/I2C Commands ....................................................................................................................... 21

Common Functionality ................................................................................................................... 24

SPI ................................................................................................................................................. 25

I C .................................................................................................................................................. 27

Programming Memory ................................................................................................................... 29

Memory Status Commands ........................................................................................................... 29

Memory Contents........................................................................................................................... 30

Calibration Step 1 – Assigning Unique Identification..................................................................... 36

Calibration Step 2 – Data Collection.............................................................................................. 36

Calibration Step 3 – Coefficient Calculations ................................................................................ 37

Bridge Signal Compensation ......................................................................................................... 37

the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.

3.4.1.

3.5.1.

3.5.2.

3.5.3.

3.6.

3.6.1.

3.6.2.

3.6.3.

3.7.

3.7.1.

3.7.2.

3.7.3.

3.8.

3.8.1.

Data Sheet

Communication Interface ..................................................................................................................... 24

Memory................................................................................................................................................. 28

Calibration Sequence ........................................................................................................................... 36

The Calibration Math ............................................................................................................................ 37

December 7, 2011

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ZSSC3016

Low Power 16 Bit Sensor Signal Conditioner IC

3.8.2.

Temperature Signal Compensation ............................................................................................... 40

Die Dimensions and Pin Assignments ........................................................................................................ 41

Related Documents..................................................................................................................................... 42

Glossary ...................................................................................................................................................... 43

Document Revision History......................................................................................................................... 44

Table of Figures

Figure 2.1

Figure 2.2

Figure 3.1

Figure 3.2

Figure 3.3

Figure 3.4

Figure 3.5

Figure 3.6

Figure 3.7

Figure 3.8

Figure 3.9

ZSSC3016 Functional Block Diagram ........................................................................................... 11

ADC Offset..................................................................................................................................... 16

Operational Flow Chart: Power up ................................................................................................ 20

Operational Flow Chart: Command Mode and Normal Mode ....................................................... 21

SPI configuration CPHA=0 ............................................................................................................ 25

SPI Configuration CPHA=1 ........................................................................................................... 26

SPI Command Request................................................................................................................. 26

SPI Read Status ............................................................................................................................ 26

SPI Read Data............................................................................................................................... 27

I C Command Request.................................................................................................................. 27

I2C Read Status ............................................................................................................................ 28

Figure 3.10 I C Read Data................................................................................................................................ 28

Figure 3.11 Memory Program Operation .......................................................................................................... 29

Figure 4.1

ZSSC3016 Pad Placement............................................................................................................ 41

List of Tables

Table 2.1

Table 2.2

Table 2.3

Table 2.4

Table 2.5

Table 2.6

Table 2.7

Table 3.1

Table 3.2

Table 3.3

Electrical Parameters. ..................................................................................................................... 8

Amplifier Gain: Stage 1.................................................................................................................. 12

Amplifier Gain: Stage 2.................................................................................................................. 12

Gain Polarity .................................................................................................................................. 13

MSB/LSB Settings ......................................................................................................................... 14

ADC Conversion Times for a single A2D conversion.................................................................... 14

Conversion Times vs. Noise Performance for 16bit fully Signal Conditioned Results

(AZBM, BM, AZTM, TM and digital SSC correction) ..................................................................... 15

ADC Offset Settings ...................................................................................................................... 16

SPI/I2C Commands ....................................................................................................................... 22

Get_Raw Commands .................................................................................................................... 23

General Status Byte ...................................................................................................................... 24

Data Sheet

December 7, 2011

the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.

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